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LIST OF TABLES
LIST OF FIGURES
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Reference
Abstract
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±âÁ¸ ³×´ú¶õµå SÞä¿¡¼­ »ý»êÇϰí ÀÖ´Â ·ÎÅ͸®½ºÅ©¸° Á¦Á¶¹æ¹ýÀº ¼®ÆÇÀμâ(lithography) ±â¼ú°øÁ¤ ¹æ¹ýÀ¸·Î¼­ °¨±¤¼º¼öÁö¸·(photoresist)°ú ³ë±¤(exposure) ¹× Çö»ó(developing) °øÁ¤À¸·Î¼­ º¹Á¦ ´É·ÂÀº ¿ì¼öÇϳª °øÁ¤ÀÌ º¹ÀâÇÏ°í °øÁ¤ °áÇÔÀÌ ¸¹ÀÌ ¹ß»ýÇÏ¿© ¾ç»ê¼ºÀÌ ÀúÁ¶ÇÑ Æ¯¼º ¹®Á¦¿Í Á¦Ç°°¡°ÝÀÌ ³ôÀº ´ÜÁ¡ ÀÖ´Ù.
ÀÌ¿¡ º» ³í¹®¿¡¼­´Â °íÁ¤¹Ðµµ, ¾ç»ê¼º, °øÁ¤´Ü¼ø, °áÇÔ µîÀ» ÃÖ¼ÒÈ­Çϱâ À§ÇÏ¿© ÀüÁÖ(electroforming)±â¼úÀ» ÀÌ¿ëÇÏ¿© ·ÎÅ͸®½ºÅ©¸°À» Á¦Á¶ÇÏ¿´´Ù. ÀüÁÖ±â¼úÀº ±Ý¼Ó¼ºÇü¹æ¹ýÀ¸·Î ¼ÒÁö¹°Ã¼(Àüµµ¼º, ºñÀüµµ¼º) À§¿¡ µµ±ÝÇÑ ÈÄ ¼ÒÁö¹°Ã¼¿Í ºÐ¸®½ÃÄÑ ÇϳªÀÇ ºÎǰÀ» Á¦Á¶Çϰųª º¹Á¦ÇÏ´Â °øÁ¤À¸·Î Ç¥¸éÀÇ ¹Ì¼¼ÇÑ Çü»óÀ» º¹Á¦ÇÏ´Â ´É·ÂÀÌ ¸Å¿ì Ź¿ùÇÏ´Ù. º» ³í¹®¿¡¼­´Â ÀÌ·¯ÇÑ ÀüÁÖ±â¼úÀ» ÀÌ¿ëÇÏ¿© ·ÎÅ͸®½ºÅ©¸° Á¦Á¶°øÁ¤À» ´Ü¼øÈ­½Ã۱â À§ÇÏ¿© Silicon Rubber MandrelÀ» Á¦ÀÛÇÏ¿´À¸¸ç, °íǰÁúÀÇ ·ÎÅ͸®½ºÅ©¸°ÀÇ Á¦Ç°À» ¾ò±â À§ÇÑ ÃÖÀûÀÇ Á¶°ÇÀ» Á¦½ÃÇϱâ À§ÇÏ¿© À̸¦ °áÁ¤Áþ´Â Áß¿äÇÑ ¿äÀÎ(é©ì×)ÀÎ pH, ½Ã°£, ³óµµ¿¡ µû¸¥ ¼³ÆÄ¹Î»ê´ÏÄÌ ¿ë¾× ÷°¡·®À» ½ÇÇèÇÏ¿© ±âÁ¸ ³×´ú¶õµå SÞä¿¡¼­ Á¦Á¶ÇÑ Á¦Ç°°ú ºñ±³ÇÑ °á°ú ±¸¸ÛÀÇ Çü»óÀÌ ´õ¿í ¶Ñ·ÇÇϰí Á¤È®ÇÏ¸ç °³±¸Å©±â(open
size)µµ 2~3% ÀÌ»ó Áõ°¡µÇ¾îÁüÀ» ¾Ë ¼ö ÀÖ¾ú´Ù. ¾ÕÀ¸·Î ÃÊÁ¤¹Ð °¡°ø±â¼úÀÌ ¿ä±¸µÇ´Â ·ÎÅ͸®½ºÅ©¸°ÀÇ °³¹ßÀº °ð ´Ù¾çÇÑ °ü·Ã »ê¾÷¿¡ ¿µÇâÀ» ¹ÌÄ¥ °ÍÀ̸ç, ÃÊÁ¤¹Ð ¹ÚÆÇ°¡°ø±â¼ú°ú ½ÃÀÓ¸®½ºÆÄÀÌÇÁ(seamless pipe) °¡°ø±â¼ú ¹× ¹Ì¼¼±¸¸Û °¡°ø±â¼ú µîÀÇ º¹ÇÕ±â¼úÀº Á¾·¡¿¡ Àü·®¼öÀÔ¿¡¸¸ ÀÇÁ¸Çϰí ÀÖ´ø ±¹³» »óǰ½ÃÀå¿¡ º¯È­¸¦ °¡Á®¿Ã ¼ö ÀÖÀ» °ÍÀÌ´Ù.

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·ÎÅ͸®½ºÅ©¸°(rotary screen)Àº 1960³â°æ¿¡ Æ÷¸£ÅõÄ®ÀÎ A.J.C. De Oliveita Barros°¡ ±Ý¼ÓÁ¦ÀÇ ¸ÁÀ» ¿øÅë»óÀ¸·Î ¿ëÁ¢ÇÑ ÈÄ ´ÏÄ̵µ±ÝÇÏ¿© ½ºÅ©¸°ÀÇ ÁöÁö¿ë(wire mesh support screen)À¸·Î »ç¿ëÇϰí, ±× À§¿¡ Æú¸®¿¡½ºÅ×·Î »ç(Þé)¿¡ ¹«´Ì¸¦ Á¶Çü(ðãû¡)ÇÑ °ÍÀ» ¹ÐÂø½Ã۰í, ¿ëÁ¢ºÎÀ§´Â ¹«´ÌÀÇ ±¸¼º¿¡ µû¶ó Ä¿¹öÇÏ´Â ¹æ½ÄÀ¸·Î »ç¿ëÇÏ´Â ³¯¿°ÇüÀ» ¸¸µå´Â ¹æ¹ýÀÌ Ã³À½À̾ú´Ù
 
Âü°íÀÚ·á (1) ½ÅÁß±Ô(2003), ³¯¿°±â¼ú(Textile printing technologies), Çü¼ºÃâÆÇ»ç.
(2) Àåµµ¿¬, À̱Ôȯ, ±è¸¸(1995), ÀüÁÖ±â¼úÀÇ ¿ø¸®¿Í ÀÀ¿ë, ±â°è¿Í Àç·á 7
±Ç, 4È£. pp. 138~155.
(3) Valerie Wilmer(1971), Electroforming, pp. 198~199.
(4) J. C. Withera, E. F. Abrams(1968), Plating, 55, 605.
(5) F. K. Santer, J. Electrochem(1963), Soc, 110, 557
(6) W. T. Mcfrlen(1970), Plating, 57, p. 46.
(7) ÀÌÈñÂù(1994), Electroplating. Patination and Electroforming for designers, pp. 138~139
(8) M. Mattia(1968), plating, 55, pp. 40~46.
(9) Carl M. Rodia(1995), Electroforming, Metal Finishing, Volume 93, Issue, Supplement, pp. 369~378.
(10) ±Ý¼ÓÇ¥¸é󏮯í¶÷À§¿øÈ¸(1990), ±Ý¼ÓÇ¥¸é󏮯í¶÷, ¼¼È­.
(11) Tony Hart and Alec Waston, Electroforming, pp. 388~399.
(12) CATIA V5 Manual(2002), Version 5.0.
(13) ¿À¼¼ÀÏ, ³ª¿µ»ó, ÀÌ»ó¿ë(2002) 3Â÷¿ø ¹Ì¼¼±¸Á¶¹° Á¦Á¶¸¦ À§ÇÑ ¹Ì¼¼Àü±âµµ±Ý¼ºÇü(Micro-Electroforming)±â¼úÀÇ ¼Ò°³. pp. 88~98.
(14) ÃÖűÔ, ±è±¤ÈÆ(1997), µµ±Ý¾× ºÐ¼®, µ¿È­±â¼ú.
(15) À̼º¿ø(1992), µµ±Ý±â¼ú, ¼¼È­
(16) C. H. Choi, H. J. Lee, S. H. Min, K. B. Kim, and D. N. Lee(1998), J. Kor. Inst. Met. Mater. 36.
(17) R. Parkinson(1998), Electroforming a unique metal fabrication process, pp. 20~24.
(18) S. Alec Watson(1990), Nickel sulphamate solution.
(19) R. W. Hampson(1957), Electroforming thin films to close tolerances, pp. 121~123.
(20) F. Albert A(1957), Electroforming of waveguide components for the millimetre-wavelength range, pp. 4~12.
(21) Barrett. R. C(1960), Plating of Nickel Cobalt, Iron and Cadmium from Sulfamate solutions, 47th Annual proceedings of the American electroplaters society Inc.
(22) D. Baudrand(1996), Nickel Sulfamate Plating, Its Mystique and Practicality,
Metal Finishing, pp. 15~18.
(23) I. Kim(2004), Study on the Mechanical Properties and Microstructure of Nickel Sulfamate Electroform, J. Kor. Inst. Surf. Eng. Vol. 37, No. 1, pp. 40~48.
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