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1. Abstract (ÃÊ·Ï
2. Introduction (¼·Ð
2-1. º» ¿¬±¸ÀÇ Çʿ伺
2-2. ÀÌ·ÐÀû ¹è°æ
2-2-1. ±ÁÈû°µµ½ÃÇè
2-2-2. ¿¬¼ºÆÄ±«¿Í Ã뼺ÆÄ±«
2-2-3. Àç·áÀÇ °µµ¿Í Àμº¿¡ ¿µÇâÀ» ÁÖ´Â ÀÎÀÚ
2-2-4. Ç¥¸é ³ëġȿ°ú
3. Experimental procedure (¿¬±¸¹æ¹ý)
3-1. ½ÇÇèÀç·áÀÇ ¼±ÅÃ
3-2. ½ÇÇè½ÃÆíÀÇ Á¦Á¶
3-3. °µµ¿Í Àμº ÃøÁ¤ ¹× ºÐ¼®
4. Results & Discussion (°á°ú ¹× °íÂû
4-1. ½Ç¸®ÄÜ ¿þÀÌÆÛÀÇ Àç·á Ư¼º Æò°¡
4-2. ½Ç¸®ÄÜ ¿þÀÌÆÛÀÇ °µµ¿Í ÀμºÀÇ Æò°¡
4-3. ½ÃÆíÀÇ ÆÄ¸éºÐ¼®
5. Summary (¿ä¾à
6. Acknowledgment (°¨»çÀÇ ±Û
7. References (Âü°í¹®Çå |
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1. Abstract
½Ç¸®ÄÜ ¿þÀÌÆÛ¸¦ ´ë»ó¼ÒÀç·Î ÇÏ¿© °ÈÀç¿Í ³ëÄ¡¿¡ µû¸¥ ±â°èÀû Ư¼ºÀÇ º¯È¸¦ Æò°¡ÇÏ¿´´Ù. ½Ç¸®ÄÜ ¿þÀÌÆÛ¸¦ ÀÛ°Ô Àß¶ó ¼öÁ÷¼±°ú ´ë°¢¼±À¸·Î ³ëÄ¡¸¦ ³½ °ÍÀÇ 2Á¾·ù¸¦ ¸¸µé°í »þÇÁ½ÉÀ» °ÈÀç·Î »ç¿ëÇÏ¿© °¢°¢ 0°³, 1°³, 2°³, 3°³, 4°³ÀÇ Á¶°ÇÀ¸·Î ¼ºÇüÇÏ¿© °ÇÁ¶½ÃŲ ÈÄ, flexural strength¿Í toughness¸¦ Àç·á½ÃÇè±â¸¦ ÀÌ¿ëÇÏ¿© ÃøÁ¤ÇÏ¿´´Ù. ³ëÄ¡ÀÇ ¹æÇâ¿¡ °ü°è¾øÀÌ °ÈÀçÀÇ °³¼ö°¡ Áõ°¡ ÇÒ¼ö·Ï strength¿Í toughness°¡ ¸ðµÎ Áõ°¡ÇÏ¿´´Ù. ¶ÇÇÑ, ¼öÁ÷¼± ³ëÄ¡ ½ÃÆíÀº flexural strength 3.85MPa, toughness 31KPa, ´ë°¢¼± ³ëÄ¡½ÃÆíÀº flexural strength 4.02MPa, toughness 26KPa·Î ¼öÁ÷¼± ³ëÄ¡ ½ÃÆíÀº toughness°¡, ´ë°¢¼± ³ëÄ¡½ÃÆíÀº strength°¡ ³ô°Ô ³ªÅ¸³µ´Ù.
2-1. º» ¿¬±¸ÀÇ Çʿ伺
20¼¼±â ÀηùÀÇ ¹®È¸¦ À̲ø¾î ³ª°¡´Â ¸¹Àº »ê¾÷ Áß¿¡ ±× ¹ßÀü ¼Óµµ ¹× ±â¿©µµ¿¡ ÀÖ¾î ÀüÀÚ »ê¾÷Àº ¸Å¿ì Áß¿äÇÑ À§Ä¡¸¦ Â÷ÁöÇÑ´Ù. °í»óÀÇ Æ®·£Áö½ºÅÍ(transistor)°¡ ¹ß¸íµÈ Áö 50³â, ±×¸®°í À̸¦ ÁýÀûȸ·Î(integrated circuit, IC)·Î ÁýÀûÈ Çϱ⠽ÃÀÛÇÑ Áö ¾à 30³âÀÓÀ» »ó±âÇϸé ÀüÀÚ »ê¾÷ÀÌ ¿ì¸® »ýȰ¿¡ ¹ÌÄ¡´Â À§·ÂÀº ½Ç·Î ´ë´ÜÇÏ´Ù°í ÇÒ ¼ö ÀÖ´Ù. ¿¹¸¦ µé¾î ÄÄÇ»ÅÍ¿Í °°Àº °ÍÀº Ãʱ⿡ Áý丸 ÇÏ´Ù°¡ ÀÚ²Ù¸¸ ÀÛ¾ÆÁ®¼ ÀÌÁ¦´Â ¼Õ¹Ù´Ú ¾È¿¡ µé¾î¿Í ÀÖÀ¸¸ç, ±× ¼º´É ¶ÇÇÑ ´Ü¼øÇÑ °è»êÀ» ÇÏ´Â ¼öÁØ¿¡¼ ÇöÀç´Â ¹«¼öÈ÷ ¸¹Àº Á¤º¸¸¦ ½Å¼ÓÈ÷ ÀúÀå, Á¤¸®Çϰí, ¿øÇÏ´Â Á¤º¸¸¦ °Ë»ö, ¿¶÷ÇÒ ¼ö ÀÖÀ¸¸ç, ±× Á¤º¸¸¦ ÅëÇØ ´Ù¸¥ ±â°è±îÁöµµ Àΰ£À» ´ë½ÅÇÏ¿© Á¶Á¤ÇÏ´Â ¼öÁرîÁö Çâ»óµÇ¾î ÀÖ´Ù. ÀÌ·¯ÇÑ ÀüÀÚ »ê¾÷ÀÇ ¹ßÀü¿¡ ÁßÃßÀûÀÎ ¿ªÇÒÀ» ´ã´çÇÏ´Â °ÍÀÌ ¹Ù·Î ¹ÝµµÃ¼ÀÌ´Ù.[1]
¹ÝµµÃ¼ »ê¾÷Àº ±â¼úÀÇ Á¾ÇÕ¼º°ú Çõ½Å¼ºÀ¸·Î ±× Ư¼ºÀ» ³ªÅ¸³¾ ¼ö ÀÖÀ¸¸ç, µû¶ó¼ ¹ÝµµÃ¼ Àç·á ¶ÇÇÑ ÀÌ·¯ÇÑ ¿ä±¸Æ¯¼º¿¡ ºÎÇյǵµ·Ï ¹ßÀüµÇ¾î ¿Ô´Ù.[2] ¿©±â¼ Á¾ÇÕ¼ºÀ̶ó ÇÔÀº ´Ù¾çÇÑ ±â¼úÀÇ Á¾ÇÕÈ·Î ¹ÝµµÃ¼ ĨÀÌ Á¦À۵Ǹç ÀÌ·¯ÇÑ º¹ÇÕµÈ ±â¼úÀ» Áö¿øÇØÁÖ´Â ´Ù¾çÇÑ Àç·á°¡ µîÀåÇÏ°Ô µÇ¾ú´Ù´Â °ÍÀ» ÀÇ
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1. Seng-Ki Joo, Byung-Yoon Kim : Metallization in semiconductor industry, 1997
2. Kunkul Ryoo : Semiconductor Materials(Silicon Wafers), 1997
3. ¹ÝµµÃ¼ Á¦Á¶»ê¾÷ ÇöȲ, Çѱ¹¹ÝµµÃ¼ »ê¾÷Çùȸ, 1996
4. http://www.wafertop.com/infor/com-3.asp
5. http://www.semimaterials.com/kor/korean/product/waferindex.htm
6. H.Y. Chung, Y.H. Kim, H.D. Yoo, and S.H. Lee : Sample Pretreatment for the Determination of Metal Impurities in Silicon Wafer, 1999
7. ±èºÎ¾È, ½Åµ¿¿ì : ¼¼¶ó¹Í½ºÆÄ±«Æ¯¼º(p.25~28), ¿øÃ¢ÃâÆÇ»ç
8. G. E. Dieter : ±Ý¼Ó°µµÇÐ(p.122), ÈñÁß´ç
9. ÀÌÁر٠: ¼¼¶ó¹Í½ºÀÇ ±â°èÀû Ư¼º(p.22~23, p.110~112), ¹ÝµµÃâÆÇ»ç
10. Baik-Woo Lee, Jae-il Jang, Dongil Kwon : Fracture Toughenss Evaluation of Small Notched Specimen in Consideration of Notch Effect and Loading Rate, 2000
11. Á¶¼ºÀç, Ç¥ÁذúÇבּ¸¿ø ¼ÒÀçÆ¯¼ºÆò°¡¼¾ÅÍ : ±ÁÈû°µµ ÃøÁ¤¹æ¹ý¿¡ °üÇÑ ISO Ç¥ÁØÈ µ¿Çâ
12. http://www.spevetro.it/lpm-ita.htm
13. http://metal.or.kr/new/college/lecture/failure/fail01-02-01.htm
14. Heon-Joo Kim and Han-Goon Kim : Relationship between Fracture Toughness and Microstructure of Steels,
15. David J. Green : An Introduction to the Mechanical Properties of Ceramics(p.280~286), Cambridge |
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