1. µ¿°æ´ë ÀüÀÚ°øÇаú ´ëÇпø ÀԽà ¹®Á¦ Ç®ÀÌ
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±âº»Æú´õ | 2008/09/08 16:25 |
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| µ¿°æ´ë ÀüÀÚ°øÇаú ´ëÇпø ÀԽà ¹®Á¦ Ç®ÀÌ 07³âµµ 8¹ø ¾çÀÚ¿ªÇÐ/°íü¹°¸® °ü·Ã ¹®Á¦ :pdfÀÚ·áÀ̸ç, ½ºÄµµÇ¾î ÀÖ½À´Ï´Ù. Âü°íÇϼ¼¿ä. | |||
| ÅÂ±× : µ¿°æ´ë ´ëÇпø, µ¿°æ´ë ÀüÀÚ°øÇÐ, ¾çÀÚ¿ªÇÐ, one dimensional harm | |||
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2. Cu low k interconnection¿¡¼ ±¸¸® »êÈ ¹æÁö¸·..
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±âº»Æú´õ | 2008/06/12 19:44 |
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| Why Cu / low-k interconnection ? High density / high speed device¿¡´ëÇѽÃÀåÀǿ䱸 Device generation (design rule) ¹Ì¼¼È->gate delay °¨¼Ò, but RC delay Áõ°¡ Power dissipation, Cross talk ->BEOL process issue ¹ß»ýÇÔ. ITRS roa.. | |||
| ÅÂ±× : Cu BEOL, Cu interconnection, Cu low k, ENIG, self assembled monol | |||
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3. Â÷¼¼´ë ÀúÀåÀåÄ¡ SSDÀÇ ÀÛµ¿¿ø¸®, application, ..
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±âº»Æú´õ | 2008/06/12 19:34 |
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| Disk drive definitions; HDD, HHD, SSD Hard disk drives (HDD) Magnetic recording°úplayback ±â¼úÀ»ÀÌ¿ë. Primary data storage·Î¼laptop, desktop, server µî¿¡»ç¿ëµÊ Hybrid disk drives (HHD) Standard HDD¿¡large buffer·Î¼flash m.. | |||
| ÅÂ±× : ssd, solid state drive, solid state disk, hhd, Â÷¼¼´ë ÀúÀåÀåÄ¡ | |||
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4. Cu low k interconnection¿¡¼ÀÇ Cu »êȹæÁö¸·¿¡..
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±âº»Æú´õ | 2008/06/11 16:24 |
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| *Project Excutive Summary ENIG electroplating process condition optimization Self-assembled monolayer treatment condition optimization Assembly process & productivity Function sample & internal reliability *Summary ElectrolessNi/Au evaluation as inh.. | |||
| ÅÂ±× : Cu low k interconnec, low k, Cu BEOL, Cu interconnect, wire bonding | |||
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5. À¯ÇÐ¿ë ¿µ¹® Ãßõ¼ (Letter of recommendation)
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±âº»Æú´õ | 2008/03/27 00:34 |
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6. Æ÷Ç×°ø´ë ´ëÇпø °úÁ¤ ¿¬±¸ °èȹ ¹× Àڱ⠼Ұ³¼
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±âº»Æú´õ | 2007/12/11 21:48 |
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7. À¯ÇÐ¿ë ±³¼ö Ãßõ¼ (Letter of recommendation)
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±âº»Æú´õ | 2007/12/11 21:30 |
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8. [°¨»ó¹®]À̰ÇÈñ °³Çõ 10³â
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±âº»Æú´õ | 2005/06/30 12:54 |
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| ÀÌ Ã¥ÀÇ ¸Ó¸®¸»Àº ¡®»ï¼º ½Å°æ¿µ, ¾ÆÁ÷ ³¡³ªÁö ¾Ê¾Ò´Ù.¡¯ÀÌ´Ù. »ï¼ºÀÇ °³Çõ ÀÛ¾÷ÀÇ ½ÃÀÛÀº Áö³ 1993³â 6¿ù À̸¥¹Ù ¡®ÇÁ¶ûũǪ¸£Æ® ¼±¾ð¡¯À¸·Î ½ÃÀ۵Ǿú°í °³ÇõÀÇ ¸·ÀÌ ¿Ã¶ú´Ù°í º¼ ¼ö ÀÖ´Ù. ´ç½Ã »ï¼ºÀüÀÚ´Â ±¹³»¿¡¼ ±Ý¼º»ç¿Í Ä¡¿ÇÑ °æÀïÀ» ¹ú¿´´ø °¡ÀüºÎ¹®ÀÇ ÈĹ߾÷ü¿´Áö¸¸.. | |||
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9. [½ÃÀå°æÁ¦]½ÃÀå°æÁ¦ÀÇ ¿ø¸®¿Í ±â¾÷ÀÇ ¿ªÇÒ
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±âº»Æú´õ | 2005/06/30 06:52 |
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| Áö±Ý±îÁö ÀϹÝÀûÀÎ °æÁ¦ÇÐÀûÀÎ Àǹ̿¡¼ °æÁ¦ ¼ºÀåÀ» ÀÌ·ç±â À§ÇØ ÇÊ¿äÇÑ °Íµé°ú ±â¾÷ÀÇ ÀÌÀ±Ãß±¸ ³ë·ÂÀÌ °æÁ¦ ¼ºÀå°ú ¾î¶² °ü°è°¡ ÀÖ´ÂÁö¸¦ »ìÆìº¸¾Ò´Ù. Áö±ÝºÎÅÍ´Â Çѱ¹ °æÁ¦ÀÇ ¼Òµæ 2¸¸ºÒ ´Þ¼ºÀ» À§ÇØ ÇÊ¿äÇÑ ¿ì¸®ÀÇ °úÁ¦¿¡ ´ëÇØ¼ ¾Ë¾Æº¸ÀÚ. ¿ì¼± Çѱ¹ °æÁ¦ÀÇ ¼Òµæ 2¸¸ºÒ .. | |||
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10. [¹ÝµµÃ¼ °øÇÐ] ³ª³ë Ŭ·¯½ºÅ͸¦ ÀÌ¿ëÇÑ ÄÝ·ÎÀ̵å ..
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±âº»Æú´õ | 2004/12/26 17:59 |
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| Si nanoparticlesÀÇ Á¦Á¶¹ý Si nanoparticleÀ» Á¦Á¶ÇÏ´Â ¹æ¹ýÀº physicalÇÑ ¹æ¹ý°ú Wet chemicalÇÑ ¹æ¹ýÀ¸·Î ³ª´ ¼ö ÀÖ´Ù. PhysicalÇÑ ¹æ¹ýÀ¸·Î´Â ion implantation°ú PECVD, sputtering µîÀÇ ¹æ¹ýÀÌ ÀÖ´Ù. wet chemicalÇÑ ¹æ¹ýÀ¸·Î´Â electrochemicalÇÑ ¹æ¹ý°ú aerosol proce.. | |||
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