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1. Cu low k interconnection¿¡¼­ ±¸¸® »êÈ­ ¹æÁö¸·..   (2,500¿ø, 15Page)   ±âº»Æú´õ | 2008/06/12 19:44
Why Cu / low-k interconnection ? 􀂙High density / high speed device¿¡´ëÇѽÃÀåÀǿ䱸 􀂙Device generation (design rule) ¹Ì¼¼È­->gate delay °¨¼Ò, but RC delay Áõ°¡ 􀂙Power dissipation, Cross talk ->BEOL process issue ¹ß»ýÇÔ. ITRS roa..
ÅÂ±× : Cu BEOL, Cu interconnection, Cu low k, ENIG, self assembled monol
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2. Â÷¼¼´ë ÀúÀåÀåÄ¡ SSDÀÇ ÀÛµ¿¿ø¸®, application, ..   (1,800¿ø, 12Page)   ±âº»Æú´õ | 2008/06/12 19:34
Disk drive definitions; HDD, HHD, SSD Hard disk drives (HDD) 􀂙Magnetic recording°úplayback ±â¼úÀ»ÀÌ¿ë. 􀂙Primary data storage·Î¼­laptop, desktop, server µî¿¡»ç¿ëµÊ Hybrid disk drives (HHD) 􀂙Standard HDD¿¡large buffer·Î¼­flash m..
ÅÂ±× : ssd, solid state drive, solid state disk, hhd, Â÷¼¼´ë ÀúÀåÀåÄ¡
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3. Cu low k interconnection¿¡¼­ÀÇ Cu »êÈ­¹æÁö¸·¿¡..   (3,000¿ø, 21Page)   ±âº»Æú´õ | 2008/06/11 16:24
*Project Excutive Summary ENIG electroplating process condition optimization Self-assembled monolayer treatment condition optimization Assembly process & productivity Function sample & internal reliability *Summary ElectrolessNi/Au evaluation as inh..
ÅÂ±× : Cu low k interconnec, low k, Cu BEOL, Cu interconnect, wire bonding
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4. À¯ÇÐ¿ë ¿µ¹® Ãßõ¼­ (Letter of recommendation)   (1,500¿ø, 1Page)   ±âº»Æú´õ | 2008/03/27 00:34
In conclusion, I certain no doubt about his steadfast of purpose and general adaptability as well as good command of english, I give him my recommendation highly.
ÅÂ±× : ±³¼ö Ãßõ¼­, ´ëÇпø Ãßõ¼­, ¿µ¹® Ãßõ¼­, À¯ÇÐ¿ë ¿µ¹® Ãßõ¼­, letter of recommenda
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5. Æ÷Ç×°ø´ë ´ëÇпø °úÁ¤ ¿¬±¸ °èȹ ¹× Àڱ⠼Ұ³¼­   (1,200¿ø, 2Page)   ±âº»Æú´õ | 2007/12/11 21:48
Çкο¡¼­ material science¿¡ ´ëÇÑ Àü¹ÝÀûÀÎ ÇнÀÀ» ÅëÇØ, Àü°ø¿¡ ´ëÇÑ ±âÃÊ Áö½ÄÀ» ÀÍÇû°í, Á¹¾÷ ÈÄ ¹ÝµµÃ¼ ȸ»ç¿¡¼­ packaging °øÁ¤ °³¹ß ¾÷¹«¸¦ Çϸ鼭 ÇкΠ°úÁ¤¿¡¼­ ¾òÁö ¸øÇß´ø ¹ÝµµÃ¼ °øÁ¤ Àü¹Ý¿¡ ´ëÇÑ Áö½Ä°ú °³¹ß process¿¡ ´ëÇÑ ÀÌÇØ µî ¸¹Àº °æÇèÀ» ¾ò¾ú´Ù. ¶Ç..
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6. À¯ÇÐ¿ë ±³¼ö Ãßõ¼­ (Letter of recommendation)   (1,500¿ø, 1Page)   ±âº»Æú´õ | 2007/12/11 21:30
It is my pleasure to recommend Mr. Choi, Hong Man who has applied for Postgraduate International Research Student Program in School of Engineering at University of Tokyo.
ÅÂ±× : Letter of recommenda, À¯ÇÐ, ±³¼ö Ãßõ¼­, Ãßõ¼­ ¾ç½Ä, ¿µ¹® Ãßõ¼­
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7. [°¨»ó¹®]À̰ÇÈñ °³Çõ 10³â   (1,500¿ø, 4Page)   ±âº»Æú´õ | 2005/06/30 12:54
ÀÌ Ã¥ÀÇ ¸Ó¸®¸»Àº ¡®»ï¼º ½Å°æ¿µ, ¾ÆÁ÷ ³¡³ªÁö ¾Ê¾Ò´Ù.¡¯ÀÌ´Ù. »ï¼ºÀÇ °³Çõ ÀÛ¾÷ÀÇ ½ÃÀÛÀº Áö³­ 1993³â 6¿ù À̸¥¹Ù ¡®ÇÁ¶ûũǪ¸£Æ® ¼±¾ð¡¯À¸·Î ½ÃÀ۵Ǿú°í °³ÇõÀÇ ¸·ÀÌ ¿Ã¶ú´Ù°í º¼ ¼ö ÀÖ´Ù. ´ç½Ã »ï¼ºÀüÀÚ´Â ±¹³»¿¡¼­ ±Ý¼º»ç¿Í Ä¡¿­ÇÑ °æÀïÀ» ¹ú¿´´ø °¡ÀüºÎ¹®ÀÇ ÈĹ߾÷ü¿´Áö¸¸..
ÅÂ±× : À̰ÇÈñ, °³Çõ, 10³â, »ï¼º, ÀÔ»ç Àü ±³À°
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8. [½ÃÀå°æÁ¦]½ÃÀå°æÁ¦ÀÇ ¿ø¸®¿Í ±â¾÷ÀÇ ¿ªÇÒ   (1,500¿ø, 7Page)   ±âº»Æú´õ | 2005/06/30 06:52
Áö±Ý±îÁö ÀϹÝÀûÀÎ °æÁ¦ÇÐÀûÀÎ Àǹ̿¡¼­ °æÁ¦ ¼ºÀåÀ» ÀÌ·ç±â À§ÇØ ÇÊ¿äÇÑ °Íµé°ú ±â¾÷ÀÇ ÀÌÀ±Ãß±¸ ³ë·ÂÀÌ °æÁ¦ ¼ºÀå°ú ¾î¶² °ü°è°¡ ÀÖ´ÂÁö¸¦ »ìÆìº¸¾Ò´Ù. Áö±ÝºÎÅÍ´Â Çѱ¹ °æÁ¦ÀÇ ¼Òµæ 2¸¸ºÒ ´Þ¼ºÀ» À§ÇØ ÇÊ¿äÇÑ ¿ì¸®ÀÇ °úÁ¦¿¡ ´ëÇØ¼­ ¾Ë¾Æº¸ÀÚ. ¿ì¼± Çѱ¹ °æÁ¦ÀÇ ¼Òµæ 2¸¸ºÒ ..
ÅÂ±× : ½ÃÀå °æÁ¦, 7000¸¸, ¹Ì¼Ç 20000, »ï¼º ÀÔ»çÀü ±³À°, »ï¼º
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9. [¹ÝµµÃ¼ °øÁ¤] ¹ÝµµÃ¼°øÁ¤ Áß oxidation½ÇÇè   (1,000¿ø, 8Page)   ±âº»Æú´õ | 2004/12/26 18:03
2) ¹ÝµµÃ¼ °øÁ¤ Áß OxidationÀÇ »ç¿ë ºÐ¾ß ¹× ÀÀ¿ë ¹æ¹ý »êÈ­(Oxidation)ÀÇ ¼¼°¡Áö ÁÖ¿ä ±â´ÉÀº Ç¥¸éº¸È£, È®»ê ¸¶½ºÅ·, À¯Àüü ÀÌ´Ù. ù ¹øÂ°·Î Ç¥¸é º¸È£´Â ½Ç¸®ÄÜÀÇ ºñÀúÇ×°ú Àüµµµµ´Â 0.001%ÀÇ dopant·Îµµ º¯È­ÇÑ´Ù. ±×·±µ¥ °øÁ¤ Áß¿¡ »ý±ä ¿À¿°À¸·Î ÀÎÇØ ÀúÇ×°ú ÀüµµÀÇ Çü..
ÅÂ±× : oxidation, »êÈ­½ÇÇè, ¹ÝµµÃ¼ °øÁ¤
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10. [¹ÝµµÃ¼ °øÇÐ] ³ª³ë Ŭ·¯½ºÅ͸¦ ÀÌ¿ëÇÑ ÄÝ·ÎÀ̵å ..   (1,000¿ø, 10Page)   ±âº»Æú´õ | 2004/12/26 17:59
Si nanoparticlesÀÇ Á¦Á¶¹ý Si nanoparticleÀ» Á¦Á¶ÇÏ´Â ¹æ¹ýÀº physicalÇÑ ¹æ¹ý°ú Wet chemicalÇÑ ¹æ¹ýÀ¸·Î ³ª´­ ¼ö ÀÖ´Ù. PhysicalÇÑ ¹æ¹ýÀ¸·Î´Â ion implantation°ú PECVD, sputtering µîÀÇ ¹æ¹ýÀÌ ÀÖ´Ù. wet chemicalÇÑ ¹æ¹ýÀ¸·Î´Â electrochemicalÇÑ ¹æ¹ý°ú aerosol proce..
ÅÂ±× : ÄÝ·ÎÀÌµå ¹ÝµµÃ¼, ±¤Ã˸Å, Quantum dot
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